Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/16/2011
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Application #:
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11511516
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Filing Dt:
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08/29/2006
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Publication #:
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Pub Dt:
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03/06/2008
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Inventors:
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Rajesh Kumar Malhan, C. Mark Johnson, Cyril Buttay, Jeremy Rashid, Florin Udrea
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Title:
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POWER ELECTRONIC PACKAGE HAVING TWO SUBSTRATES WITH MULTIPLE SEMICONDUCTOR CHIPS AND ELECTRONIC COMPONENTS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, SHOWA-CHO |
| KARIYA-CITY, AICHI-PREF. 448-8661, JAPAN |
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| 9, JJ THOMPSON AVENUE |
| CAMBRIDGE CB3 0FA, UNITED KINGDOM |
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| MAPPIN STREET |
| SHEFFIELD S1 3JD, UNITED KINGDOM |
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| DAVID G. POSZ |
| POSZ LAW GROUP, PLC |
| 12040 SOUTH LAKES DRIVE |
| SUITE 101 |
| RESTON, VA 20191 |
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