Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
2
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
11847512
|
Filing Dt:
|
08/30/2007
|
Publication #:
|
|
Pub Dt:
|
03/06/2008
| | | | |
Inventors:
|
Dennis Lang, Sonbol Vaziri, Neill Thornton, Eric Woolsey, Chung-Lin Wu, Mike Gruenhagen et al
|
Title:
|
RELIABLE WAFER-LEVEL CHIP-SCALE PACKAGE SOLDER BUMP STRUCTURE IN A PACKAGED SEMICONDUCTOR DEVICE
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
82 RUNNING HILL ROAD |
MS 35-4E |
SOUTH PORTLAND, MAINE 04106 |
|
|
|
THOMAS R. FITZGERALD, ESQ. |
HISCOCK & BARCLAY, LLP |
2000 HSBC PLAZA, 100 CHESTNUT ST. |
ROCHESTER, NY 14604-2404 |
|
|
Assignment:
2
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
5005 E. MCDOWELL ROAD, MD A700 |
PHOENIX, ARIZONA 85008 |
|
|
|
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
5005 E. MCDOWELL ROAD |
MD A700 |
PHOENIX, AZ 85008 |
|
|
Search Results as of:
05/13/2024 05:39 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|