Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11846047
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Filing Dt:
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08/28/2007
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Publication #:
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Pub Dt:
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03/06/2008
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Inventor:
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Toshio SHINTANI
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Title:
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METHOD OF SEMICONDUCTOR WAFER BACK PROCESSING, METHOD OF SUBSTRATE BACK PROCESSING, AND RADIATION-CURABLE PRESSURE-SENSITIVE ADHESIVE SHEET
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-2, SHIMOHOZUMI 1-CHOME |
| OSAKA |
| IBARAKI-SHI, JAPAN |
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| SUGHRUE MION, PLLC |
| 2100 PENNSYLVANIA AVE |
| WASHINGTON, DC 20037 |
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