Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11519896
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Filing Dt:
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09/13/2006
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Publication #:
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Pub Dt:
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03/13/2008
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Inventors:
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Bo-Wei Chen, Hsien-Shou Wang, Shih-Ping Hsu
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Title:
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Flip chip substrate structure and the method for manufacturing the same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 6, LI-HSIN RD., SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN |
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| BACON & THOMAS, PLLC |
| 625 SLATERS LANE |
| FOURTH FLOOR |
| ALEXANDRIA, VA 22314 |
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