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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
7598166
Issue Dt:
10/06/2009
Application #:
11530116
Filing Dt:
09/08/2006
Publication #:
20080061403
Pub Dt:
03/13/2008
Inventors:
Zhong-Xiang He, Ning Lu, Anthony Kendall Stamper
Title:
DIELECTRIC LAYERS FOR METAL LINES IN SEMICONDUCTOR CHIPS
Assignment: 1
Reel/Frame:
018220/0640Recorded: 09/08/2006Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
HE, ZHONG-XIANG
Exec Dt:
08/17/2006
LU, NING
Exec Dt:
08/17/2006
STAMPER, ANTHONY K.
Exec Dt:
08/17/2006
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondent:
WILLIAM D. SABO
1000 RIVER STREET
972E
ESSEX JUNCTION, VT 05452
Assignment: 2
Reel/Frame:
056442/0296Recorded: 06/01/2021Pages: 6
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE CONVEYING PARTY DATA NAME PREVIOUSLY RECORDED AT REEL: 018220 FRAME: 0640. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Assignors:
HE, ZHONG-XIANG
Exec Dt:
08/17/2006
LU, NING
Exec Dt:
08/17/2006
STAMPER, ANTHONY KENDALL
Exec Dt:
08/17/2006
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondent:
IBM CORPORATION
22 CENTURY HILL DRIVE
SUITE 302
LATHAM, NY 12110

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