Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11852132
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Filing Dt:
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09/07/2007
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Publication #:
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Pub Dt:
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03/13/2008
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Inventor:
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Tomoo Hayashi
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Title:
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WAFER PROCESSING METHOD AND WAFER PROCESSING APPARATUS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7-1, SHIMORENJAKU 9-CHOME |
| MITAKA-SHI |
| TOKYO, JAPAN |
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| CHRISTIE, PARKER & HALE, LLP |
| P.O. BOX 7068 |
| PASADENA, CA 91109-7068 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7-1, SHIMORENJAKU 9-CHOME |
| MITAKA-SHI |
| TOKYO, JAPAN |
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| CHRISTIE, PARKER & HALE, LLP |
| P.O. BOX 7068 |
| PASADENA, CA 91109-7066 |
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Assignment:
3
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CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF THE ASSIGNEE LISTED AS TOKYO SEIMITSU CO., LTD PREVIOUSLY RECORDED ON REEL 019865 FRAME 0638. ASSIGNOR(S) HEREBY CONFIRMS THE NAME OF THE ASSIGNEE SHOULD READ TOKYO SEIMITSU CO., LTD..
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| 7-1, SHIMORENJAKU 9-CHOME |
| MITAKA-SHI |
| TOKYO, JAPAN |
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| CHRISTIE, PARKER & HALE, LLP |
| P.O. BOX 7068 |
| PASADENA, CA 91109-7068 |
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