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Patent Assignment Abstract of Title

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Total Assignments: 2

Patent #:	NONE	Issue Dt:		Application #:	11522759	Filing Dt:	09/18/2006
Publication #:	20080067669	Pub Dt:	03/20/2008
Inventor:	Nicole A. Buttel
Title:	Thermal interface layer utilizing both thermal film and spherical spacers to control thickness in a semiconductor die package.

Assignment: 1

Reel/Frame:

018322/0356

Recorded: 09/18/2006

Pages: 2

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignor:

BUTEL, NICOLE A.

Exec Dt:

09/18/2006

Assignee:

AVAGO TECHNOLOGIES, LTD.

4380 ZIEGLER ROAD

M/S 76

FORT COLLINS, COLORADO 80525

Correspondent:

AVAGO TECHNOLOGIES, LTD.

C/O KLAAS, LAW, O'MEARA & MALKIN, P.C.

P.O. BOX 1920

DENVER, CO 80201-1920

Assignment: 2

Reel/Frame:

018865/0870

Recorded: 02/07/2007

Pages: 4

Conveyance:

CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME AND ADDRESS ON A DOCUMENT PREVIOUSLY RECORDED ON REEL 018322 FRAME 0356. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT OF ASSIGNOR'S INTEREST.

Assignor:

BUTEL, NICOLE A.

Exec Dt:

09/18/2006

Assignee:

AVAGO TECHNOLOGIES ENTERPRISE IP (SINGAPORE) PTE. LTD.

NO. 1 YISHUN AVENUE 7

SINGAPORE, SINGAPORE 768923

Correspondent:

AVAGO TECHNOLOGIES, LTD.

P.O. BOX 1920

DENVER, CO 80201-1920

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