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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
11577214
Filing Dt:
04/13/2007
Publication #:
20080067704
Pub Dt:
03/20/2008
Inventors:
Hitoshi Ohmori, Yoshihiro Uehara, Weimin Lin, Hatsuichi Takeyasu, Masao Washio et al
Title:
Micro-Molding Equipment and Micro-Molding Method
Assignment: 1
Reel/Frame:
019156/0796Recorded: 04/13/2007Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
OHMORI, HITOSHI
Exec Dt:
04/02/2007
UEHARA, YOSHIHIRO
Exec Dt:
04/02/2007
LIN, WEIMIN
Exec Dt:
04/02/2007
TAKEYASU, HATSUICHI
Exec Dt:
04/02/2007
WASHIO, MASAO
Exec Dt:
04/02/2007
IKEGAMI, KEIZO
Exec Dt:
04/02/2007
SHOJI, TAKEYA
Exec Dt:
04/02/2007
ANDO, TOMOAKI
Exec Dt:
04/02/2007
SHIRATAKI, YUKIHIRO
Exec Dt:
04/02/2007
Assignees:
RIKEN
2-1, HIROSAWA, WAKO-SHI
SAITAMA, JAPAN 351-0198
THE NEXSYS CORPORATION
HIROSE BUILDING 9F
3-17, KANDA NISHIKI-CHO,
CHIYODA-KU, TOKYO, JAPAN 101-0054
SAN SEIMITSU KAKO LAB., LTD.
707-4, TOKOROGUKI, KUKI-SHI
SAITAMA, JAPAN 346-0034
IKEGAMI MOLD ENGINEERING CO., LTD.
5-5-30, MINAMI, KUKI-SHI
SAITAMA, JAPAN 346-0004
ASTOM R&D
WAKO MH BUILDING 3F
1-10-5, MARUYAMADAI, WAKO-SHI
SAITAMA, JAPAN 351-0112
Correspondent:
GRIFFIN & SZIPL, P.C.
2300 9TH STREET SOUTH
SUITE PH-1
ARLINGTON, VA 22204

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