Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11566242
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Filing Dt:
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12/04/2006
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Publication #:
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Pub Dt:
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03/27/2008
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Inventors:
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Wen-Kun Yang, Dyi-Chung Hu, Chih-Ming Chen, Hsien-Wen Hsu
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Title:
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CHIP PACKAGE AND CHIP PACKAGE ARRAY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 65, GUANGFU N. RD., HUKOU TOWNSHIP |
| HSINCHU COUNTY, TAIWAN 303 |
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| JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE |
| 7F.-1, NO. 100, ROOSEVELT RD., SEC. 2 |
| TAIPEI, 100 TAIWAN |
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