Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11524291
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Filing Dt:
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09/21/2006
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Publication #:
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Pub Dt:
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03/27/2008
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Inventor:
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Seiji Nakagawa
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Title:
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Apparatus and method for heating semiconductor wafers with improved temperature uniformity
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 9775 TOLEDO WAY |
| IRVINE, CALIFORNIA 92618 |
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| BANNER & WITCOFF, LTD. |
| 1001 G STREET, N.W., 11TH FLOOR |
| WASHINGTON, D.C. 20001-4597 |
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