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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
06/16/2009
Application #:
11905804
Filing Dt:
10/04/2007
Publication #:
Pub Dt:
04/10/2008
Inventors:
Ho-Ming Tong, Kao-Ming Su, Chao-Fu Weng, Teck-Chong Lee, Chian-Chi Lin, Chia-Jung Tsai et al
Title:
TWO-STAGE DIE-BONDING METHOD FOR SIMULTANEOUS DIE-BONDING OF MULTIPLE DIES
Assignment: 1
Reel/Frame:
019982/0308Recorded: 10/04/2007Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/28/2006
Exec Dt:
09/13/2006
Exec Dt:
09/06/2007
Exec Dt:
09/06/2006
Exec Dt:
09/06/2006
Exec Dt:
09/06/2006
Exec Dt:
09/06/2006
Exec Dt:
09/06/2006
Assignee:
NO. 26, JINGSAN RD., NANTZ CHIU
KACHSIUNG, TAIWAN ROC 811
Correspondent:
JOE MCKINNEY MUNCY
BIRCH, STEWART, KOLASCH & BIRCH, LLP
8110 GATEHOUSE ROAD, SUITE 100 EAST
P.O. BOX 747
FALLS CHURCH, VA 22040-0747

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