Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11818754
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Filing Dt:
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06/15/2007
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Publication #:
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Pub Dt:
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04/24/2008
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Inventors:
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Tetsuya Utano, Yutaka Kondo, Toru Maeda
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Title:
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Wire bonding and wire bonding method
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2-51-1, INADAIRA |
MUSASHIMURAYAMA-SHI, TOKYO, JAPAN |
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WILLIAM L. ANDROLIA |
KODA & ANDROLIA |
2029 CENTURY PARK EAST, SUITE 1140 |
LOS ANGELES, CA 90067-2983 |
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