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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
11976235
Filing Dt:
10/23/2007
Publication #:
Pub Dt:
05/01/2008
Inventors:
Jun Ishii, Yasunari Ooyabu, Hiroyuki Kurai
Title:
Method for producing a wired circuit board
Assignment: 1
Reel/Frame:
020177/0605Recorded: 11/29/2007Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/13/2007
Exec Dt:
09/18/2007
Exec Dt:
09/17/2007
Assignee:
1-2, SHIMO-HOZUMI 1-CHOME
IBARAKI, OSAKA, JAPAN 567-8680
Correspondent:
JEAN C. EDWARDS
801 PENNSYLVANIA AVENUE N.W. SUITE 600
WASHINGTON, DC 20004

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