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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
11/09/2010
Application #:
11795921
Filing Dt:
09/20/2007
Publication #:
Pub Dt:
05/08/2008
Inventors:
Keiichi Kimura, Tomohiro Uno
Title:
GOLD WIRE FOR CONNECTING SEMICONDUCTOR CHIP
Assignment: 1
Reel/Frame:
019884/0159Recorded: 09/25/2007Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/25/2007
Exec Dt:
07/25/2007
Assignee:
6-3, OTEMACHI 2-CHOME, CHIYODA-KU
TOKYO, JAPAN 100-8071
Correspondent:
JOHN J. KELLY, JR., ESQ.
KENYON & KENYON LLP
ONE BROADWAY
NEW YORK, NEW YORK 10004-5288
Assignment: 2
Reel/Frame:
052183/0361Recorded: 03/17/2020Pages: 21
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/01/2012
Assignee:
7-16-3, GINZA, CHUO-KU
TOKYO, JAPAN 104-0061
Correspondent:
HUNTON ANDREWS KURTH LLP
2200 PENNSYLVANIA AVE
SUITE 900
WASHINGTON, DC 20037
Assignment: 3
Reel/Frame:
052183/0480Recorded: 03/17/2020Pages: 45
Conveyance:
MERGER AND CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/01/2012
Newly Merged Entity Data
Exec Dt:
10/01/2012
Newly Merged Entity's New Name:
13-1, NIHONBASHI 1-CHOME, CHUOKU
TOKYO, JAPAN 103-0027
Correspondent:
HUNTON ANDREWS KURTH LLP
2200 PENNSYLVANIA AVE
SUITE 900
WASHINGTON, DC 20037

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