Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11936220
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Filing Dt:
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11/07/2007
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Publication #:
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Pub Dt:
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05/08/2008
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Inventor:
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Eiichi Hosomi
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Title:
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Semiconductor device has interposer with conductive layer arranged on part of main surface of semiconductor chip, connected to semiconductor chip via connection pin and connected to external electrode for power supply via wire
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, SHIBAURA 1-CHOME |
| MINATO-KU, TOKYO, JAPAN 105-8001 |
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| AMIN, TUROCY & CALVIN, LLP |
| 24TH FLOOR, NATIONAL CITY CENTER |
| 1900 EAST NINTH STREET |
| CLEVELAND, OH 44114 |
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