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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
09/01/2009
Application #:
10595736
Filing Dt:
05/08/2006
Publication #:
Pub Dt:
05/29/2008
Inventors:
Michael G. Todd, James T. Huneke, Gordon C. Fischer, Lawrence N. Crane
Title:
ELECTRONIC PACKAGING MATERIALS FOR USE WITH LOW-K DIELECTRIC-CONTAINING SEMICONDUCTOR DEVICES
Assignment: 1
Reel/Frame:
022989/0777Recorded: 07/22/2009Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/05/2004
Exec Dt:
11/05/2004
Exec Dt:
11/05/2004
Exec Dt:
12/09/2004
Assignee:
ONE HENKEL WAY
ROCKY HILL, CONNECTICUT 06067
Correspondent:
HENKEL CORPORATION
ONE HENKEL WAY
ROCKY HILL, CT 06067

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