Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11942529
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Filing Dt:
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11/19/2007
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Publication #:
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Pub Dt:
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05/29/2008
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Inventors:
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Myeong-Soon PARK, In-Young LEE, Ho-Jin LEE, Yong-Tae OH
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Title:
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METHOD OF FORMING METAL LAYER WIRING STRUCTURE ON BACKSIDE OF WAFER, METAL LAYER WIRING STRUCTURE FORMED USING THE METHOD, METHOD OF STACKING CHIP PACKAGE, AND CHIP PACKAGE STACK STRUCTURE FORMED USING THE METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, |
| GYEONGGI-DO, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF |
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| MARGER JOHNSON & MCCOLLOM, P.C. |
| 210 SW MORRISON STREET, SUITE 400 |
| PORTLAND, OR 97204 |
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