Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11594603
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Filing Dt:
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11/08/2006
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Publication #:
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Pub Dt:
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05/29/2008
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Inventors:
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Weng Fei Wong, Fu Mauh Wong
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Title:
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Semiconductor package with encapsulant delamination-reducing structure and method of making the package
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 1 YISHUN AVENUE 7 |
| SINGAPORE, SINGAPORE 768923 |
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| AVAGO TECHNOLOGIES, LTD. |
| P.O. BOX 1920 |
| DENVER, CO 80201-1920 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME PREVIOUSLY RECORDED ON REEL 018724 FRAME 0913. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT OF ASSIGNOR'S INTEREST.
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| NO. 1 YISHUN AVENUE 7 |
| SINGAPORE, SINGAPORE 768923 |
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| AVAGO TECHNOLOGIES, LTD. |
| P.O. BOX 1920 |
| DENVER, CO 80201-1920 |
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