Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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04/27/2010
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Application #:
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12007874
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Filing Dt:
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01/16/2008
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Publication #:
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Pub Dt:
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05/29/2008
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Inventors:
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Shinji Ohuchi, Yasuo Tanaka
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Title:
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RESIN FOR SEALING SEMICONDUCTOR DEVICE, RESIN-SEALED SEMICONDUCTOR DEVICE AND THE METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-4-8 SHIN-YOKOHAMA, KOHOKU-KU |
| YOKOHAMA 222-8575, JAPAN |
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| RABIN & BERDO, PC |
| 1101 14TH STREET, NW |
| SUITE 500 |
| WASHINGTON, DC 20005 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 550-1 HIGASHIASAKAWA-CHO |
| HACHIOJI-SHI, TOKYO, JAPAN 193-8550 |
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| KUBOTERA & ASSOCIATES, LLC |
| 200 DAINGERFIELD ROAD |
| SUITE 202 |
| ALEXANDRIA, VA 22314 |
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Assignment:
3
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 2-4-8 SHINYOKOHAMA, KOUHOKU-KU |
| YOKOHAMA, JAPAN 222-8575 |
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| RABIN & BERDO, P.C. |
| 1101 14TH ST., N.W., SUITE 500 |
| WASHINGTON, DC 20005 |
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