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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/08/2011
Application #:
11662285
Filing Dt:
03/09/2007
Publication #:
Pub Dt:
06/05/2008
Inventors:
Hiroji Aga, Norihiro Kobayashi, Hiroshi Takeno, Masayuki Imai, Tatsuo Enomoto
Title:
METHOD OF MANUFACTURING SOI WAFER AND THUS-MANUFACTURED SOI WAFER
Assignment: 1
Reel/Frame:
019023/0011Recorded: 03/09/2007Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/24/2007
Exec Dt:
01/26/2007
Exec Dt:
01/24/2007
Exec Dt:
01/27/2007
Exec Dt:
01/26/2007
Assignee:
4-2, MARUNOUCHI 1-CHOME, CHIYODA-KU
TOKYO, JAPAN 100-0005
Correspondent:
SNIDER & ASSOCIATES
P.O. BOX 27613
WASHINGTON, D.C. 20038-7613

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