Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11638884
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Filing Dt:
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12/13/2006
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Publication #:
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Pub Dt:
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06/19/2008
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Inventors:
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Romi Mayder, Kris Rexroad, Pamela Stellmacher
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Title:
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Solid via with a contact pad for mating with an interposer of an ATE tester
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 1 YISHUN AVE. 7 |
SINGAPORE, SINGAPORE 768923 |
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VALERLE BAKES |
VERIGY LTD. |
LEGAL DEPARTMENT |
4700 INNOVATION DRIVE, BUILDING, D1 |
FORT COLLINS, CO 80525 |
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