Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/20/2010
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Application #:
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11954679
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Filing Dt:
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12/12/2007
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Publication #:
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Pub Dt:
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06/19/2008
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Inventors:
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Chih-Ming Chen, Deng-Huei Hwang, Ching-Chi Cheng, An-Nong Wen
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Title:
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SIDE-VIEW OPTICAL DIODE PACKAGE AND FABRICATING PROCESS THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1F, NO. 1, LI-HSIN 1ST RD., SCIENCE PARK |
| HSINCHU, TAIWAN 30078 |
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| EVAN R. WITT |
| 60 EAST SOUTH TEMPLE, |
| SUITE 1800 |
| SALT LAKE CITY, UT 84111 |
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