Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
12/22/2009
|
Application #:
|
11928041
|
Filing Dt:
|
10/30/2007
|
|
Publication #:
|
|
Pub Dt:
|
06/19/2008
| | | | |
|
Inventors:
|
Ching-Chun Wang, Yen-Yi Wu, Sem-Wei Lin
|
|
Title:
|
THREE-DIMENSIONAL PACKAGE AND METHOD OF MAKING THE SAME
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 26 CHIN 3RD ROAD |
| NANTZE EXPORT PROCESSING ZONE |
| KAOBSIUNG, TAIWAN R.O.C. |
|
|
|
|
| ANDREW J. TELESZ, JR. |
| VOLENTINE & WHITT, P.L.L.C. |
| 11951 FREEDOM DRIVE, SUITE 1260 |
| RESTON, VA 20190 |
|
|
Search Results as of:
05/02/2024 03:32 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
