Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/12/2009
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Application #:
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11356437
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Filing Dt:
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02/17/2006
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Publication #:
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Pub Dt:
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07/03/2008
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Inventors:
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Katsumi Ohashi, Masanobu Horino, Yasuhiro Onishi
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Title:
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SOLDER MATERIAL TEST METHOD AND APPARATUS, CONTROL PROGRAM AND COMPUTER-READABLE RECORDING MEDIUM
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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801, MINAMIFUDODO-CHO, HORIKAWAHIGASHIIRU |
SHIOKOJI-DORI, SHIMOGYO-KU |
KYOTO-SHI, KYOTO 600-8530, JAPAN |
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WILLIAM T. ELLIS |
FOLEY & LARDNER LLP |
WASHINGTON HARBOUR |
3000 K STREET, N.W., ST. 500 |
WASHINGTON, DC 20007-5143 |
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