Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11965214
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Filing Dt:
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12/27/2007
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Publication #:
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Pub Dt:
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07/10/2008
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Inventors:
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Manabu Hirasawa, Koji Izunome, Koji Araki, Tatsuhiko Aoki
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Title:
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HEAT TREATMENT METHOD FOR SILICON WAFER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6-3, OHSAKI 1-CHOME |
| SHINAGAWA-KU |
| TOKYO, 141-0032, JAPAN |
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| PAUL D. STRAIN |
| FOLEY & LARDNER LLP |
| WASHINGTON HARBOUR |
| 3000 K STREET NW, SUITE 500 |
| WASHINGTON, D.C. 20007-5143 |
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