Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11622529
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Filing Dt:
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01/12/2007
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Publication #:
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Pub Dt:
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07/17/2008
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Inventor:
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Seiji Nakagawa
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Title:
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Pumping and Dispensing System for Coating Semiconductor Wafers
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 9775 TOLEDO WAY |
| IRVINE, CALIFORNIA 92618 |
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| JORDAN N. BODNER |
| 1001 G STREET, NW |
| 11TH FLOOR |
| WASHINGTON, DC 20001-4597 |
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