Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
2
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
11653725
|
Filing Dt:
|
01/12/2007
|
Publication #:
|
|
Pub Dt:
|
07/17/2008
| | | | |
Inventors:
|
Sychyi Fang, Wen Kun Yang, Chen Lung Tsai
|
Title:
|
Under bump metallurgy structure of a package and method of making same
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
1171 SONORA COURT |
SUNNYVALE, CALIFORNIA 94086 |
|
|
|
RONALD L. YIN |
DLA PIPER US LLP |
2000 UNIVERSITY AVENUE |
EAST PALO ALTO, CA 94303 |
|
|
Assignment:
2
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
303 NO. 65, KUANG-FU NORTH ROAD |
HSIN CHU INDUSTRIAL PARK |
HU KOU, HSIN-CHU COUNTY, TAIWAN R.O.C. |
|
|
|
RONALD L. YIN |
DLA PIPER US LLP |
2000 UNIVERSITY AVENUE |
EAST PALO ALTO, CA 94303 |
|
|
Search Results as of:
05/14/2024 10:13 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|