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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/09/2010
Application #:
11898750
Filing Dt:
09/14/2007
Publication #:
Pub Dt:
07/17/2008
Inventors:
Yuji Awano, Masataka Mizukoshi
Title:
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Assignment: 1
Reel/Frame:
019882/0293Recorded: 09/14/2007Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/31/2007
Exec Dt:
08/31/2007
Assignee:
1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU
KAWASAKI-SHI
KANAGAWA 211-8588, JAPAN
Correspondent:
KRATZ, QUINTOS & HANSON, LLP
SUITE 400, 1420 K STREET, N.W.
WASHINGTON, DC 20005

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