Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/07/2012
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Application #:
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12013246
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Filing Dt:
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01/11/2008
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Publication #:
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Pub Dt:
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07/24/2008
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Inventors:
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Takashi Shoji, Takekazu Sakai, Tetsuo Kubota
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Title:
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METHOD FOR ATTACHMENT OF SOLDER POWDER TO ELECTRONIC CIRCUIT BOARD AND SOLDER-ATTACHED ELECTRONIC CIRCUIT BOARD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 13-9, SHIBA DAIMON 1-CHOME |
| MINATO-KU, TOKYO, JAPAN 105-8518 |
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| SUGHRUE MION, PLLC |
| 2100 PENNSYLVANIA AVENUE, N.W. |
| SUITE 800 |
| WASHINGTON, DC 20037 |
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