Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11685915
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Filing Dt:
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03/14/2007
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Publication #:
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Pub Dt:
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07/31/2008
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Inventors:
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Kenneth S. Collins, Hiroji Hanawa, Andrew Nguyen, Ajit Balakrishna, Valentin N. Todorow et al
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Title:
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TEMPERATURE-SWITCHED PROCESS FOR WAFER BACKSIDE POLYMER REMOVAL AND FRONT SIDE PHOTORESIST STRIP
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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P.O. BOX 450-A |
LEGAL AFFAIRS DEPARTMENT |
SANTA CLARA, CALIFORNIA 95052 |
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APPLIED MATERIALS, INC. |
P.O. BOX 450-A |
LEGAL AFFAIRS DEPT. |
SANTA CLARA, CA 95052 |
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