Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11699876
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Filing Dt:
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01/30/2007
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Publication #:
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Pub Dt:
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07/31/2008
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Inventor:
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Brian J. Coppa
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Title:
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Shallow trench isolation using atomic layer deposition during fabrication of a semiconductor device
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8000 S. FEDERAL WAY |
| MS 1-525, P.O. BOX 6 |
| BOISE, IDAHO 83707 |
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| KEVIN D. MARTIN |
| MS 1-525 |
| 8000 S. FEDERAL WAY |
| P.O. BOX 6 |
| BOISE, ID 83707 |
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