Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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02/19/2013
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Application #:
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11956932
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Filing Dt:
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12/14/2007
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Publication #:
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Pub Dt:
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08/07/2008
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Inventors:
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Hangbin SONG, Peng WANG
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Title:
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TAPE FOR SEMICONDUCTOR PACKAGE AND CUTTING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8 XIHUANZHONGLU, BDA |
| BEIJING, CHINA 100176 |
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| SHERIDAN ROSS PC |
| 1560 BROADWAY |
| SUITE 1200 |
| DENVER, CO 80202 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.10 JIUXIANQIAO RD, CHAOYANG |
| BEIJING, CHINA 100015 |
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| NO.8 XIHUANZHONG RD, BDA |
| BEIJING, CHINA 100176 |
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| CPA GLOBAL LIMITED |
| LIBERATION HOUSE |
| CASTLE STREET |
| ST HELIER, JE1 1BL JERSEY |
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