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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
11701409
Filing Dt:
02/02/2007
Publication #:
Pub Dt:
08/07/2008
Inventors:
Shih-Ping Hsu, Chung-Cheng Lien, Kan-Jung Chia, Shang-Wei Chen
Title:
Carrier plate structure havign a chip embedded therein and the manufacturing method of the same
Assignment: 1
Reel/Frame:
018979/0930Recorded: 02/02/2007Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/24/2006
Exec Dt:
11/27/2006
Exec Dt:
11/27/2006
Exec Dt:
11/27/2006
Exec Dt:
11/27/2006
Assignee:
2, TAKARA-CHO, KANAGAWA-KU
YOKOHAMA-SHI, KANAGAWA 221-0023, JAPAN
Correspondent:
GLENN LAW
FOLEY & LARDNER LLP
WASHINGTON HARBOUR
3000 K STREET NW, SUITE 500
WASHINGTON, D.C. 20007-5143
Assignment: 2
Reel/Frame:
018962/0518Recorded: 02/02/2007Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/26/2007
Exec Dt:
01/26/2007
Exec Dt:
01/26/2007
Exec Dt:
01/26/2007
Assignee:
NO. 6, LI-HSIN RD.
SCIENCE-BASED INDUSTRIAL PARK
HSINCHU, TAIWAN R.O.C.
Correspondent:
BACON & THOMAS, PLLC
625 SLATERS LANE
FOURTH FLOOR
ALEXANDRIA, VA 22314

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