Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11701409
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Filing Dt:
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02/02/2007
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Publication #:
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Pub Dt:
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08/07/2008
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Inventors:
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Shih-Ping Hsu, Chung-Cheng Lien, Kan-Jung Chia, Shang-Wei Chen
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Title:
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Carrier plate structure havign a chip embedded therein and the manufacturing method of the same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2, TAKARA-CHO, KANAGAWA-KU |
YOKOHAMA-SHI, KANAGAWA 221-0023, JAPAN |
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GLENN LAW |
FOLEY & LARDNER LLP |
WASHINGTON HARBOUR |
3000 K STREET NW, SUITE 500 |
WASHINGTON, D.C. 20007-5143 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 6, LI-HSIN RD. |
SCIENCE-BASED INDUSTRIAL PARK |
HSINCHU, TAIWAN R.O.C. |
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BACON & THOMAS, PLLC |
625 SLATERS LANE |
FOURTH FLOOR |
ALEXANDRIA, VA 22314 |
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