Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11852287
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Filing Dt:
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09/08/2007
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Publication #:
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Pub Dt:
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08/07/2008
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Inventor:
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Shih-Ping Hsu
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Title:
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SEMICONDUCTOR PACKAGE SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 6, LI-HSIN ROAD, SCIENCE-BASED INDUSTRIAL PARK |
HSIN-CHU, TAIWAN |
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MIKIO ISHIMARU |
ISHIMARU & ZAHRT LLP |
333 W. EL CAMINO REAL, SUITE # 330 |
SUNNYVALE, CA 94087 |
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