Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11826223
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Filing Dt:
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07/13/2007
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Publication #:
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Pub Dt:
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08/14/2008
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Inventors:
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Weilin Gao, Hisashi Suda, Hiroto Narieda, Akira Sugawara
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Title:
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Cu-Ni-Si-based copper alloy sheet material and method of manufacturing same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 14-1, SOTOKANDA 4-CHOME |
| CHIYODA-KU, TOKYO, JAPAN 101-0021 |
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| TRACY BOYDEN |
| 1090 VERMONT AVENUE, NW |
| STE 250, CLARK & BRODY |
| WASHINGTON, DC 20005 |
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