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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
10/05/2010
Application #:
11852888
Filing Dt:
09/10/2007
Publication #:
Pub Dt:
08/14/2008
Inventors:
Hidefumi HATANAKA, Tsutomu ADACHI, Youichi YOKOTE, Miho IMASHIOYA, Tomohiko TANIGUCHI
Title:
ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING THE SAME
Assignment: 1
Reel/Frame:
020874/0494Recorded: 04/29/2008Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/05/2007
Exec Dt:
10/02/2007
Exec Dt:
10/03/2007
Exec Dt:
10/02/2007
Exec Dt:
10/11/2007
Assignees:
6 TAKEDA TOBADONO-CHO
FUSHIMI-KU, KYOTO, JAPAN 612-8501
1-8-1 IZUMIHON-CHO, KOMAE
TOKYO, JAPAN 201-8648
Correspondent:
HOGAN & HARTSON L.L.P.
1999 AVENUE OF THE STARS
SUITE 1400
LOS ANGELES, CA 90067

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