Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11708475
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Filing Dt:
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02/21/2007
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Publication #:
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Pub Dt:
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08/21/2008
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Inventors:
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Wen-Kun Yang, Hsien-Wen Hsu, Ya-Tzu Wu, Ching-Shun Huang
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Title:
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Multi-chips package with reduced structure and method for forming the same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 65, GUANGFU N. RD., HUKOU TOWNSHIP |
| HSINCHU COUNTY 303, TAIWAN R.O.C. |
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| EUGENE MAR |
| BACON & THOMAS, PLLC |
| 625 SLATERS LANE FOURTH FLOOR |
| ALEXANDRIA, VA 22314 |
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