Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/19/2011
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Application #:
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11706367
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Filing Dt:
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02/15/2007
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Publication #:
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Pub Dt:
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08/21/2008
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Inventors:
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Yoshitaka Sasaki, Tatsushi Shimizu
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Title:
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METHOD OF MANUFACTURING ELECTRONIC COMPONENT PACKAGE, AND WAFER AND SUBSTRUCTURE USED FOR MANUFACTURING ELECTRONIC COMPONENT PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 678 S. HILLVIEW DR. |
| MILPITAS, CALIFORNIA 95035 |
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| 6 SCIENCE PARK EAST AVENUE, HONG KONG SCIENCE PARK, SHATIN, N.T. |
| SAE TECHNOLOGY CENTRE |
| HONG KONG, CHINA |
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| JAMES A. OLIFF |
| OLIFF & BERRIDGE, PLC |
| P.O. BOX 19928 |
| ALEXANDRIA, VA 22320 |
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