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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
02/02/2010
Application #:
12068459
Filing Dt:
02/06/2008
Publication #:
Pub Dt:
08/21/2008
Inventor:
Ryugo Oba
Title:
WAFER PROCESSING METHOD AND LASER PROCESSING APPARATUS
Assignment: 1
Reel/Frame:
020537/0946Recorded: 02/06/2008Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/28/2008
Assignee:
13-11, OMORI-KITA 2-CHOME, OTA-KU
TOKYO, JAPAN 143-8580
Correspondent:
MICHAEL A. MAKUCH
SMITH, GAMBRELL & RUSSELL, LLP
1130 CONNECTICUT AVENUE
SUITE 1130
WASHINGTON, DC 20036
Assignment: 2
Reel/Frame:
020539/0383Recorded: 02/06/2008Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/28/2008
Assignee:
13-11, OMORI-KITA 2-CHOME, OTA-KU
TOKYO 143-8580, JAPAN
Correspondent:
MICHAEL A. MAKUCH
SMITH, GAMBRELL & RUSSELL, LLP
1130 CONNECTICUT AVENUE - SUITE 1130
WASHINGTON, DC 20036

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