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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
02/01/2011
Application #:
12044271
Filing Dt:
03/07/2008
Publication #:
Pub Dt:
09/11/2008
Inventors:
Lin-Yin Wong, Zao-Kuo Lai
Title:
CHIP CARRIER STRUCTURE HAVING SEMICONDUCTOR CHIP EMBEDDED THEREIN AND METAL LAYER FORMED THEREON
Assignment: 1
Reel/Frame:
020616/0050Recorded: 03/07/2008Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/25/2008
Exec Dt:
02/25/2008
Assignee:
NO. 6, LI-HSIN ROAD, SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU, TAIWAN
Correspondent:
SCHMEISER OLSEN & WATTS
18 E UNIVERSITY DRIVE
SUITE # 101
MESA, AZ 85201
Assignment: 2
Reel/Frame:
025516/0877Recorded: 12/17/2010Pages: 3
Conveyance:
MERGER (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/08/2010
Assignee:
NO. 38 HSING PONG RD., KWEI SAN INDUSTRIAL ZONE
TAOYUAN, TAIWAN
Correspondent:
SCHMEISER, OLSEN & WATTS, LLP
18 E. UNIVERSITY DRIVE, SUITE 101
MESA, AZ 85201

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