Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11523719
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Filing Dt:
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09/20/2006
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Publication #:
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Pub Dt:
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09/18/2008
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Inventors:
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Han-Ping Pu, Chien-Ping Huang
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Title:
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Leadframe-based semiconductor package and fabrication method thereof
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 123, SEC. 3, DA FONG ROAD, TANTZU |
| TAICHUNG, TAIWAN ROC |
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| JOE MCKINNEY MUNCY |
| BIRCH, STEWART, STEWART, ET AL. |
| 8110 GATEHOUSE ROAD, SUITE 100 EAST |
| P.O. BOX 747 |
| FALLS CHURCH, VA 22040-0747 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 123, SEC. 3, DA FONG ROAD, TANTZU |
| TAICHUNG, TAIWAN |
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| BIRCH, STEWART, KOLASCH & BIRCH, LLP |
| P.O. BOX 747 |
| FALLS CHURCH, VA 22040-0747 |
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