Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12075745
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Filing Dt:
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03/13/2008
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Publication #:
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Pub Dt:
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09/18/2008
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Inventors:
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Atsushi Yabe, Junnosuke Sekiguchi, Toru Imori
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Title:
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Method for forming a seed layer for damascene copper wiring, and semiconductor wafer with damascene copper wiring formed using the method
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 10-1, TORANOMON 2-CHOME |
| MINATO-KU, TOKYO, JAPAN |
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| TERRYENCE F. CHAPMAN |
| 2026 RAMBLING ROAD |
| KALAMAZOO, MI 49008-1631 |
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