skip navigationU S P T O SealUnited States Patent and Trademark Office AOTW logo
Home|Site Index|Search|Guides|Contacts|eBusiness|eBiz alerts|News|Help
Assignments on the Web > Patent Query
Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
12051619
Filing Dt:
03/19/2008
Publication #:
20080230923
Pub Dt:
09/25/2008
Inventors:
Cha-Jea JO, Myung-Kee CHUNG, Nam-Seog KIM, In-Young LEE, Seok-Ho KIM, Ho-Jin LEE et al
Title:
CHIP STACK PACKAGE AND METHOD OF MANUFACTURING THE CHIP STACK PACKAGE
Assignment: 1
Reel/Frame:
020675/0480Recorded: 03/19/2008Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
JO, CHA-JEA
Exec Dt:
02/10/2008
CHUNG, MYUNG-KEE
Exec Dt:
03/14/2008
KIM, NAM-SEOG
Exec Dt:
03/10/2008
LEE, IN-YOUNG
Exec Dt:
03/10/2008
KIM, SEOK-HO
Exec Dt:
03/10/2008
LEE, HO-JIN
Exec Dt:
03/14/2008
CHOI, JU-IL
Exec Dt:
03/10/2008
SHIN, CHANG-WOO
Exec Dt:
03/10/2008
Assignee:
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI,
GYEONGGI-DO, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF
Correspondent:
MARGER JOHNSON & MCCOLLOM, P.C.
210 SW MORRISON STREET, SUITE 400
PORTLAND, OR 97204

Search Results as of: 05/12/2024 05:27 AM
If you have any comments or questions concerning the data displayed, contact PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified: August 25, 2017 v.2.6
| .HOME | INDEX| SEARCH | eBUSINESS | CONTACT US | PRIVACY STATEMENT