Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/14/2010
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Application #:
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12073690
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Filing Dt:
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03/07/2008
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Publication #:
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Pub Dt:
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10/02/2008
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Inventors:
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Naohiko Hirano, Akira Tanahashi, Satoshi Soga, Yoshitsugu Sakamoto, Takashi Ishii et al
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Title:
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SOLDER PREFORM AND A PROCESS FOR ITS MANUFACTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 23 SENJU-HASHIDO-CHO |
| ADACHI-KU |
| TOKYO 120-8555, JAPAN |
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| 1-1 SHOWA-CHO, KARIYA-SHI |
| AICHI 448-8661, JAPAN |
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| MICHAEL TOBIAS |
| 1629 K STREET N.W., SUITE 300 |
| WASHINGTON, D.C. 20006 |
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