Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11936596
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Filing Dt:
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11/07/2007
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Publication #:
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Pub Dt:
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10/02/2008
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Inventor:
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Wen-Kun YANG
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Title:
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SEMICONDUCTOR DEVICE PACKAGE WITH DIE RECEIVING THROUGH-HOLE AND DUAL BUILD-UP LAYERS OVER BOTH SIDE-SURFACES FOR WLP AND METHOD OF THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 65, GUANGFU NO. RD., HUKOU TOWNSHIP |
HSINCHU COUNTY 303, TAIWAN |
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LAWRENCE A. MAXHAM |
THE MAXHAM FIRM |
9330 SCRANTON ROAD, SUITE 350 |
SAN DIEGO, CA 92121 |
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