Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12080798
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Filing Dt:
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04/04/2008
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Publication #:
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Pub Dt:
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10/09/2008
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Inventors:
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Jeng-Yuan Lai, Chien-Ping Huang, Chih-Ming Huang, Yu-Po Wang, Cheng-Hsu Hsiao
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Title:
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Heat dissipation unit and semiconductor package having the same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 123, SEC. 3, DA FONG RD., TANTZU |
| TAICHUNG, TAIWAN ROC |
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| PETER F. CORLESS |
| EDWARDS ANGELL PALMER & DODGE LLP |
| P.O. BOX 55874 |
| BOSTON, MA 02205 |
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