Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/18/2011
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Application #:
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12138076
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Filing Dt:
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06/12/2008
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Publication #:
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Pub Dt:
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10/09/2008
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Inventors:
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Takahiro TOMITA, Hiroki FUJITA
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Title:
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BONDING MATERIAL, PROCESS FOR PRODUCING THE SAME, AND HONEYCOMB STRUCTURE MADE WITH THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-56, SUDA-CHO, MIZUHO-KU |
| NAGOYA-CITY, AICHI-PREFECTURE 467-8530, JAPAN |
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| JAMES A. OLIFF |
| OLIFF & BERRIDGE, PLC |
| P.O. BOX 320850 |
| ALEXANDRIA, VA 22320-4850 |
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