Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/24/2009
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Application #:
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11697543
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Filing Dt:
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04/06/2007
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Publication #:
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Pub Dt:
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10/09/2008
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Inventors:
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Sheng-Chieh Liu, Tzu-Yang Wu, Ya-Wen Lee, Jeffrey Chu, Chia-Hung Kao, Hsueh-Liang Chou
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Title:
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METHOD AND DEVICE FOR WAFER BACKSIDE ALIGNMENT OVERLAY ACCURACY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN ROAD 6 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN 300-77 |
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| BONNIE BOYLE |
| 901 MAIN STREET |
| SUITE 3100 |
| DALLAS, TX 75202 |
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