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Patent Assignment Abstract of Title

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Total Assignments: 2

Patent #:	8120161	Issue Dt:	02/21/2012	Application #:	11733658	Filing Dt:	04/10/2007
Publication #:	20080251859	Pub Dt:	10/16/2008
Inventors:	Ralf Otremba, Lutz Goergens, Gerhard Noebauer, Tien Lai Tan, Marco Puerschel et al
Title:	SEMICONDUCTOR MODULE INCLUDING SEMICONDUCTOR CHIPS COUPLED TO EXTERNAL CONTACT ELEMENTS

Assignment: 1

Reel/Frame:

019789/0388

Recorded: 09/06/2007

Pages: 5

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

OTREMBA, RALF

Exec Dt:

05/04/2007

GOERGENS, LUTZ

Exec Dt:

07/16/2007

NOEBAUER, GERHARD

Exec Dt:

06/15/2007

LAI, CHARLIE TAN TIEN

Exec Dt:

07/15/2007

HUBER, ERWIN

Exec Dt:

06/25/2007

PUERSCHEL, MARCO

Exec Dt:

05/30/2007

DELAROZEE, GILLES

Exec Dt:

06/25/2007

DINKEL, MARKUS

Exec Dt:

06/25/2007

Assignee:

INFINEON TECHNOLOGIES AG

ST.-MARTIN-STRASSE 53

MUENCHEN, GERMANY 81669

Correspondent:

SLATER & MATSIL, L.L.P.

17950 PRESTON RD.

SUITE 1000

DALLAS, TX 75252

Assignment: 2

Reel/Frame:

020869/0235

Recorded: 04/29/2008

Pages: 10

Conveyance:

CORRECTIVE ASSIGNMENT TO CORRECT THE FOURTH ASSIGNOR'S NAME PREVIOUSLY RECORDED ON REEL 019789 FRAME 0388. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT OF ASSIGNOR'S INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

OTREMBA, RALF

Exec Dt:

05/04/2007