Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11734483
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Filing Dt:
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04/12/2007
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Publication #:
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Pub Dt:
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10/16/2008
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Inventors:
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CHIU SUNG CHENG, HSIU-MEI YU, CHIA-JEN CHENG, C.T. CHUANG, CHUN-YEN LO, LI-HSIN TSENG
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Title:
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UBM structure for strengthening solder bumps
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN |
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| BAKER & MCKENZIE LLP |
| 2001 ROSS AVE., SUITE 2300 |
| DALLAS, TX 75201 |
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